USPTO Patents Application 10724954

Applicant : Ryosuke Usui et al. Attorney's Docket No.: 14225-035001 / F1030610US00

Serial No. : 10/724,954

Filed : December 1 , 2003

Page : 2 of 10

Amendments to the Claims :
This listing of claims replaces all prior versions and listings of claims in the application:

Listing of Claims :

1. (Currently amended) A circuit device manufacturing method comprising:

forming separation grooves in a conductive foil from a top surface to form conductive
patterns that are integrally connected at the bottom portion of the conductive foil;

mounting a circuit element onto d e sir e d location one or more of the conductive patterns;

and

sealing with a resin layer so as to cover the circuit element and fill the separation
grooves;

wherein plasma is irradiated onto the top surface of the conductive foil.

2. (Currently amended) A circuit device manufacturing method comprising:

forming separation grooves in a conductive foil from a top surface to form conductive
patterns that are integrally connected at the bottom portion of the conductive foil;

mounting a circuit element onto d e sired location one or more of the conductive patterns;

irradiating plasma onto the top surface of the conductive foil, including the circuit
element; and

sealing with a resin layer so as to cover the circuit element and fill the separation
grooves.

3. (Original) The method of Claim 1, wherein irradiation of the plasma is carried out prior to the
step of mounting the circuit element.

Applicant : Ryosuke Usui et al. Attorney's Docket No.: 14225-035001 / F1030610US00

Serial No. : 10/724,954
Filed : December 1,2003
Page : 3 of 10

4. (Currently amended) The method of Claim 1, wherein irradiation of the plasma is carried out
subsequent to the step of mounting the circuit element.

5. (Currently amended) The method of Claim 1 or 2, wherein contaminants attached to the
surfaces of the separation grooves are removed by the plasma.

6. (Original) The method of Claim 5, wherein the contaminants comprise organic or inorganic
matter.

7. (Original) The method of Claim 1 or 2, wherein the surface of the separation grooves are [[is]]
roughened by the plasma irradiation.

8. (Original) The method of Claim 1 or 2, wherein the surface of the separation groove s are [[is]]
oxidized by the plasma irradiation.

9. (Original) The method of Claim 1 or 2, wherein the plasma irradiation is carried out using
oxygen gas.

10. (Original) The method of Claim 1 or 2, wherein the plasma irradiation is carried out using an
inert gas , such as argon, n e on, or h e lium .

11. (Original) The method of Claim 1 or 2, wherein the conductive foil is formed of a metal
having copper as the principal material.

12. (Original) The method of Claim 1 or 2, wherein the circuit element comprises a [[is]]
semiconductor element that is electrically connected to one or more of the conductive patterns
via metal wires.

Applicant : Ryosuke Usui et al. Attorney's Docket Na: 14225-035001 / F1030610US00

Serial No. : 10/724,954

Filed : December 1, 2003

Page : 4 of 10

13. (Original) The method of Claim 1 or 2, wherein the rear surface of the conductive foil is
eliminated until the resin layer is exposed e xpos e s at the rear surface of the conductive foil to
electrically separate the respective conductive patterns.

14. (New) The method of claim 1 wherein the separation grooves extend only partially through
the conductive foil.